NEW Wave solder system 

Unique technology benefits

• Oxide and void-free joint surface between chip and ceramic substrate
• Integrated or separate cleaning and de-scaling processes
• Fast heating and cooling rates
• Closed enclosure allows different vacuum processes to be performed
• Simple profiling
• Assembly under high level of vacuum
• Integration of drying and degassing processes
• Better dispersal of waste heat
• No contamination residues on product
• Further miniaturisation possible