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SMT Quick-Tips 3: Selecting a Selective Soldering System
SMT Quick-Tips: Selecting a Selective Soldering System
Pros and cons of selective soldering
 
While there is often no other practical way to handle boards with hybrid components except manual soldering, selective soldering has the usual set of advantages and disadvantages.
 
Pros: Near-perfect joints, lower labor and rework costs than manual, reduced training and staffing costs for skilled hand labor, excellent joint consistency, high production efficiency.
 
Cons: Generally more expensive than wave, although their costs have been coming done recently as they’ve become more popular; speed is relatively slow compared with wave, but considerably faster than manual soldering in a production environment.
 
Options with Selective
 

As with all other types of machine soldering, there are multiple types of fluxing, preheating and soldering methods, which we’ll dig into in later chapters. For now, here are some things to be aware of:
 
Fluxing Technology
 
Two types are available: Spray and Microdrop.
 
The Spray type is generally faster, has been time-tested over many years of service, and has higher solids flux capability. Downsides to Spray are: it leaves more flux residue, requires more maintenance and has more wear parts that may need replacing.
 
Microdrop fluxing is more accurate, provides better hole filling, leaves little residue and is generally maintenance free. However, it costs more, runs a bit slower and is more complicated to program.
 
Preheating Technology
 
Preheating minimizes thermal shock before soldering. Preheat systems can be integral with the selective soldering machine or offered as an optional module.
 
Quick IR, Area IR, and Area Quartz techniques are available, and can be employed on both the bottom and the top of the board. Area Quartz is usually specified for thick boards.
 
IR provides quick response and is gradient controllable, whereas some form of convection delivers a lower gradient but a more uniform heat transfer quality. A combination of the two may be used for high thermal mass applications.
 
Soldering Technology
 
There are three common types of soldering technologies available: Jet Wave, Wettable Nozzles, and Hybrid (Mini-Wave and Dip combination).
 
Jet Wave is similar to wave soldering in that it’s directional and has the same benefits as wave. Its smallest solder diameter is 4mm, it requires minimal maintenance, and it is fairly low cost.
 
Wettable Nozzles solder in every direction, 360 degrees, or in either the x or y direction. It is easy to control the wave height, and its smallest diameter is 3mm. It costs more than Jet Wave and requires daily maintenance.
 
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