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W2 Soldering Fountain
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
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Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
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10 menu storage
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Overhead locator laser light pinpoints position for centering components over the wave
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Height ajustable stainless steel platform
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Large selection of nozzles for all component sizes
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Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
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"Blow-thru" hot air nozzle option removes solder remaining in through holes during rework process
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High temperature (350°C), compatible with lead-free operation
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Univeral X, Y, & Z Board Fixture Option for board sizes up to 11" x 16.5" (280 x 420mm)
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