The Role of Each Part of THT Wave Soldering Equipment

 

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Flux area: It is the area where the PCB is coated with flux before soldering. Because of its different structure, the coating method is also different.

 

Preheating zone: It is the area where the PCB after applying the flux is heated, so that the flux reaches the best activity.

The main functions of preheating heating are:

1. Promote activation of flux;

2. Volatilize and dry the solvent and moisture in the flux;

3. Prevent the PCB from damaging the PCB due to the sharp heating of the printed board, and provide it with a transitional heat.

 

The role of the tin pot: the solder has a pump (impeller) that is driven from the low position of the groove to the nozzle of the high position. The solder produces wave crests (spraying to form a flowing mirror surface) at the bulge, and it is too late to form oxide film and debris on the wave crest surface. Maintaining a clean state, the printed board can ensure the welding quality under the wetting and activation of the flux.

 

Cooling zone: The cooling zone is a device for cooling the PCB after soldering. The rapid cooling of the printed board after welding is very necessary. If the printed board does not cool quickly after welding, the temperature will continue to rise to a higher value due to the residual heat of the component leads after welding. Therefore, the heat must be released as soon as possible after welding to prevent the bonding force of the copper foil of the printed board from decreasing and causing damage to the components.