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Types and design standards of pads in PCB design
Let’s learn about the types of pads and the design standards of pads in PCB design today. The land, the basic unit of surface mount assembly, is used to form the land pa...Show DetailsHow to implement CSP/BGA bottom potting
Through the above schematic diagram of the BGA soldering process, we can find that after the BGA chip is soldered, there is enough space at the bottom of the PCB and the ...Show DetailsWhat basic requirements should epoxy resin potting material meet?
Epoxy resin potting materials should meet the following basic requirements: good performance, long pot life, suitable for mass automatic production line operations; low ...Show DetailsFeatures of BGA package
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With the increasing number of packaged devices such as Flip-Chip and BGA, the number of spherical pins of this type of device has increased, forcing the size of the solde...Show DetailsAnalysis of the Causes of Tin Beads in Printing
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