NEW Wave solder system
From: Author:NEW Wave solder system Publish time:2017-05-05 12:42 Clicks:0
NEW Wave solder system
Unique technology benefits
- Oxide and void-free joint surface between chip and ceramic substrate
- Integrated or separate cleaning and de-scaling processes
- Fast heating and cooling rates
- Closed enclosure allows different vacuum processes to be performed
- Simple profiling
- Assembly under high level of vacuum
- Integration of drying and degassing processes
- Better dispersal of waste heat
- No contamination residues on product
- Further miniaturisation possible