With the development of life, people have higher and higher requirements for cars, and the internal structure of cars has become more and more diversified and intelligent. In recent years, many cars have been equipped with driving-assisting cameras and radars, etc., realizing auxiliary driving functions such as lane departure prevention and automatic emergency braking, and the ECUs that control them are becoming more and more multifunctional.

In the future, in order to realize autonomous driving, it is expected that in-vehicle electronic equipment will continue to increase, and the connectors used are also required to have a higher level of heat resistance and vibration resistance, and are mainly used in body electronics and battery management systems.

 

 

To achieve high-reliability and high-performance interconnection between PCBs, board-to-board connectors are an important solution. But experience tells us that the more this kind of high-density interconnection, the more "squeaky" the interface of the connection, once its electrical connection or mechanical structure is damaged, it is likely to cause performance degradation.

The first is the external environment. For example, in automotive and industrial applications, the more complex and harsh working environment will cause shock and vibration to the connector, which is easy to understand.

Secondly, it comes from vibration sources inside the system, such as motors in industrial applications. And with the expansion of motor applications, many consumer applications, such as washing machines, dishwashers, mixers, etc., also need to consider the impact of continuous vibration.

The connector is usually the "interface" between the PCB motherboard and the "external components", so it may sometimes encounter considerable external forces. Components assembled by through-hole technology are much higher in reliability than corresponding SMT components. Whether it is strong pulling, squeezing or thermal shock, it can withstand, and it is not easy to leave the PCB.

Smart consumer and automotive electronics, 5G communication equipment is getting smaller and more powerful, making the application of through-hole components less and less. However, the through-hole soldering process (PiP) has better mechanical and electrical reliability than surface mount technology (SMT). Using wave crest or selective soldering equipment is more expensive and requires more process steps. The through-hole welding can use the existing SMT equipment to optimize the process to save cost and investment, and increase the space of the production workshop.

SMT through-hole reflow soldering process-used to mount perforated components and special-shaped components, Past-In-Hole (PIH) is to print solder paste directly on PCB (Print Circuit Board) PTH (Plating Through Hole), and then insert the traditional plug-in/through hole components (DIP insert parts) directly into the plated through holes that have been printed with solder paste. At this time, the solder paste on the plated through holes is large. Part of it will stick to the solder feet of the plug-in parts. These solder pastes will re-melt when the high temperature of the reflow soldering furnace is used, and then the parts will be soldered on the circuit board.

This method has other names called "pin-in-paste", "intrusive reflow soldering" and "ROT, reflow of through-hole) "Etc.; the advantage of this method is that it can eliminate the manual soldering or wave soldering process and save labor hours. It can also improve the quality of soldering and reduce solder short circuits. )chance.