The difference between SMT and DIP
From: Author: Publish time:2019-03-15 11:24 Clicks:0
SMT is the surface mount technology (short for Surface Mount Technology) and is currently the most popular technology and process in the electronics assembly industry. It is a circuit mounting technology in which surface-mounted components are mounted on the surface of a circuit board or other substrate, and soldered by reflow soldering or dip soldering.
DIP, an abbreviation for Dual In-line Package, refers to a device packaged in a plug-in form with a pin count of typically no more than 100. The often mentioned "DIP soldering" or "DIP soldering" refers to soldering DIP packaged devices after SMT.
SMT patches are typically mounted on leadless or short lead surface mount components. Solder paste is printed on the board first, then mounted on a placement machine, and then soldered to the device. DIP solders are devices that are packaged in a straight-in form and are fixed by wave soldering or manual soldering.
DIP solders are devices that are packaged in a straight-in form and are fixed by wave soldering or manual soldering.
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