wave soldering machine:

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Dual Wave Soldering Machine

Lead-Free Computerized Nitrogen Dual Wave Soldering Machine

Features: 
★ Step motor spraying system
★ Electric adjusting width function
★ Dual-hard disk configuration in computer
★ Shrapnel double hooked chain claws in Titanium alloy
★ Automatic feeding board function
★ Abnormal temperature alarm
★ Subsection preheat function
★ Projecting light compensation function
★ Temperature profile testing system
★ Temperature profile analyzing system
★ Automatic up/down and in/out of solder pot (option)

Lead-free or Tin-lead Through-hole Soldering
The 16.350's adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 350 mm x 350 mm (13.75" sq.).

As PCBs are loaded onto the adjustable titanium finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.
Run as Dual or Single Wave
Solder processing temperature is settable to a lead-free compatible 300°C. The system includes an economical low-volume 250 kg (550 lbs. Approximate weight for lead free solder) capacity solder pot with an easy-handling roll-out feature. A built-in alarm signals when solder level is at the refill point.

16.350 features dual wave soldering for through-hole and surface mount soldering. The chip wave provides a turbulent wave crest to ensure complete coverage of every joint, eliminating solder skip defects. It's followed by a secondary wave that facilitates the draining of excess solder away from the joints, preventing bridging and solder accumulation.

Wave angle is adjustable, and the chip wave can be deactivated through the user interface for non-SMT applications.

A second solder pot is available, with quick-connect capability, to allow for fast changeover between leaded and lead-free solders.
Forced Hot Air Convection Pre-Heat
The preheat stage takes place in a 600 mm (23.6") glass-covered chamber where boards are heat-bathed by energy-saving forced hot air convection, as opposed to power-consuming, uneven IR heat.
Self-Cleaning Titanium Finger Conveyor
To maximize throughput, conveyor speed setting is variable from 0.5 – 2.2 m/min (20" – 87"/min).

An optional center PCB support rail can be added to maintain planarity and prevent sagging of oversize boards through the wave module.

An automatic finger cleaner for the conveyor's titanium fingers is included.
Fully Supported
16.350 comes with a one-year parts warranty plus email and telephone support provided by factory-trained Manncorp technicians. Onsite installation and training is also available.
Brief

Dual Wave Soldering Machine,Lead-free or Tin-lead Through-hole Soldering

The 16.350's adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 350 mm x 350 mm (13.75" sq.).